ANSYS R19.3: Next-Generation Pervasive Engineering

ANSYS has many enhancements in the release of 2019 R3. The core mechanical, fluids, and electromagnetic physics software has been improved as noted below and more functionality has been added to the Discovery series of programs for the designer.  Please see the descriptions below and links for more information.

To download 19.3, access the ANSYS Customer Portal or contact us and we can help facilitate access to the software.




Innovations to ANSYS structural solutions in ANSYS 2019 R3 enable you to:

  • Study large assembly models with millions of design points with ANSYS Motion, an advanced multibody dynamic solver now integrated into ANSYS Mechanical.

  • Quickly and accurately predict product failure early in the design stage for electronic hardware at the component, board and system levels with the addition of ANSYS Sherlock.

  • Translate electronic computer-aided design (ECAD) models into finite element analysis (FEA) geometries in minutes and build on FEA information to predict time to failure.

  • Evaluate operating systems with distributed compute services (DCS) — a new family of applications to distribute, manage, solve and optimize design challenges on a variety of compute resources.

  • Simulate tightly coupled thermal and structural field analysis with two new streamlined workflows in Mechanical. Easily capture the interaction of thermal and structural loads with static and transient simulations.

  • Perform inverse analyses with Mechanical. The inverse solver can determine the shape of a model prior to extreme loads and deformation — sometimes referred to as “hot-to-cold” analysis.

  • Benefit from 120 additional materials within Mechanical from the ANSYS GRANTA Materials Data for Simulation database, including electromagnetic properties data where appropriate.



This release advances the new ANSYS Fluent user experience. For example, you can now use Mosaic-enabled meshes to run parametric studies in ANSYS Workbench, and apply fault-tolerant meshes to support nonconformal interfaces when simulating conjugate heat transfer. Plus, the Fluent expression language capability is newly available for use with parameters, reports and monitors.

 Numerous other important updates and additions augment your computational fluid dynamics (CFD) analyses over a broader range of applications:

  •  An automated workflow accelerates the Fluent adjoint solver and generates an organic, optimal shape for multiple objectives and operating conditions.

  • Fluent more quickly and easily evaluates complex reduced-order models (ROMs) for improved design exploration.

  • ANSYS Forte can be combined with Fluent or ANSYS Mechanical for more accurate, conjugate heat transfer analysis.


ANSYS Acquisition of Granta.jpg

This release introduces ANSYS GRANTA Selector. Based on 25 years of materials selection technology embodied in the earlier CES Selector products, the new Selector offers a refreshed look, great new features and integration with ANSYS products. It facilitates smart materials choices through a comprehensive materials data library and a series of tools for filtering, analyzing and applying the data. It delivers optimized data for comparisons, equivalency studies and selection of metal grades, improved support for simulation and an enhanced user experience. 

ANSYS GRANTA Materials Data for Simulation is now accessible through ANSYS Electronics Desktop for electromagnetics simulation. The latest release extends coverage to include key electromagnetic properties, along with mechanical and thermal properties. With 700-plus records across many important materials classes, the materials database minimizes data search and conversion time. The same enlarged dataset is available in ANSYS Mechanical.


ANSYS 2019 R3 delivers electromagnetic field simulation solutions to aid our customers’ pursuit of the engineering megatrends of autonomy, 5G connectivity and electrification. New features include:

  • Expansion of ANSYS Cloud offering to ANSYS Electronic Desktop — users of ANSYS HFSS, ANSYS Maxwell and ANSYS Q3D Extractor can now benefit from high-performance computing options available in ANSYS Cloud.

  • ANSYS HFSS receives significant upgrade in distributed memory solver speed.

  • ANSYS HFSS and ANSYS HFSS SBR+ include new capabilities for modeling and post-processing complex radar cross section scenarios required for autonomous system simulation.

  • Creeping wave physics has been added to ANSYS HFSS SBR+, a significant new capability to accurately predict radar cross section of large targets with curvatures.

  • Dramatic speed improvements for simulating IC packages and PCB’s with the HFSS regions in SIwave hybrid solution — HFSS regions can now be distributed across compute resources and solved in parallel.

3D Design

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ANSYS Discovery Live introduces the first-ever, interactive topology optimization tool for generative design, as well as new simulation functionality, including mass flow outlets and time varying inputs for transient studies. With these enhancements, you can easily evaluate a broad spectrum of product behaviors and uncover optimal design solutions in record time.

Additions to ANSYS Discovery SpaceClaim include automatic surface reconstruction from faceted geometry, such as STL. This process converts triangle-based models into smooth watertight CAD models for reverse engineering and generative design workflows. Visualization improvements produce higher-quality renderings for an enhanced user experience

In ANSYS Discovery AIM, you will now find support for structural beams, physics-aware meshing enhancements and linear buckling capabilities. The release offers more proven, easy-to-use functionality — from mesh failure visualization to structural stability evaluation — than ever before.


Additive Manufacturing

ANSYS Additive Prep has a new build processor: You can now export a build file directly to an additive manufacturing (AM) machine.

 ANSYS Workbench Additive enables toggling between the STL supports, meshes and element densities. It includes an option (in the AM process sequencer) for removing the STL supports after cooldown.

 ANSYS Additive Print offers new support-related features:

 The support-only cutoff feature helps you cut the support from the part — without separating the part from the baseplate under the displacement.

  • The support groups feature accounts for multiple support types (volume-less, solid) in a single simulation.



This release further integrates optical simulation into the ANSYS environment. ANSYS SPEOS now includes meshed geometry support — which enables mesh data import from the multiphysics workflow — and head-up display (HUD) optical design, which generates the optimal layout and shapes for the best driver experience.

SPEOS Live Preview offers more flexibility and ease of use. With one click, you can switch between true and false color, adjust the scale adaptation to fit with the results preview, select the sensor type for preview and much more.

Also added is the SPEOS Road Library for Sensors Simulation. It contains retro-reflecting materials — asphalt, signs, paint, vegetation, etc. — which can be detected by any sensor.

The release introduces new ambient and thermal source models for more realistic simulations of sky and sun environments. And, with a new feature for simulating rotating lidar, SPEOS facilitates quick field-of-view studies.

SPEOS also delivers a more intuitive interface for an improved user experience.


Platform (ANSYS Cloud)

You can slash hours or days off your simulation runtimes and increase the size and fidelity of your models by unlocking nearly unlimited compute capacity with ANSYS Cloud. Built upon the highly secure Microsoft® Azure™ platform, ANSYS Cloud provides easy access to on-demand compute cores directly from ANSYS Mechanical, ANSYS Fluent and ANSYS Electronics Desktop. New with this release, ANSYS Maxwell users can now take advantage of this secure compute platform by selecting from preconfigured high-performance computing (HPC) configurations, which have been optimized to provide the best performance-to-cost ratio for their electromechanical applications.

 In addition, ANSYS 2019 R3 introduces a true multiphysics collaboration offering. ANSYS Minerva , powered by Aras’ resilient platform, is a centralized simulation knowledge management application that stores data, project plans and analytics for easy accessibility by team members across geographies and functional silos. By providing a single, centralized repository of critical simulation expertise, Minerva can help you deliver your next-generation products to market faster and at lower development costs.



The ANSYS semiconductor portfolio of power efficiency, power integrity and reliability solutions achieves ISO 26262 “Tool Confidence Level 1” (TCL1) certification. This certification enables automotive integrated circuit (IC) designers to meet rigorous safety requirements for ADAS and autonomous applications.

Auto chip makers can leverage ANSYS PowerArtist, ANSYS Totem and ANSYS RedHawk family of multiphysics simulations for all ISO 26262 safety-related development projects at any Automotive Safety Integrity Level. Next-generation system-on-chip (SoC) solutions for automotive, artificial intelligence (AI) and 5G applications are facing shrinking design margins along with increasing cost and time-to-market pressures. ANSYS RedHawk-SC can solve these problems by addressing complex multiphysics challenges in these designs that use advanced FinFET processes and 3D-IC packaging technologies. RedHawk-SC in ANSYS 2019 R3 will include major foundry certifications for a comprehensive list of FinFET nodes down to 5nm, significant performance improvement for self-heat and thermal-aware electromigration analysis and orders-of-magnitude reduction in runtime for effective resistance calculation.




ANSYS 2019 R3 updates make it quicker and easier for you to build, validate and deploy simulation-based digital twins for predictive maintenance in ANSYS Twin Builder to optimize your product's operation and extends its lifetime. Electrification-specific enhancements to Twin Builder enable you to better simulate battery management systems and deploy digital twins for other electrification applications. Additional advances in this release include Modelica enhancements, new reduced-order model (ROM) capabilities and an improved electronics control module (ECM) toolkit.

 ANSYS medini analyze extends its functional safety analysis expertise beyond automotive and aerospace to industrial equipment requiring IEC 61508 standardization. It includes consistent safety integrity level (SIL) management covering process hazard analysis (PHA), systems requirements and system design. Failure modes, effects and diagnostic analysis (FMEDA) with safe failure fraction (SFF) and diagnostic coverage (DC) computations are also covered.

 The release includes innovative sensor and sound simulations in ANSYS VRXPERIENCE as well as new capabilities in virtual reality (VR), providing a software-in-the-loop connector from the HMI. VRXPERIENCE now includes multi-bounce ray casting in the ideal ground-truth sensor; flashing and rotating models of physics-based lidar; and a dynamic live preview enabling geometry movement during SPEOS Live Preview. ANSYS SCADE Suite and SCADE Display integration makes it easy to interact with your embedded software in VR.